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#6765. A simplified correction method for thermocouple disturbance errors in solids
| November 2026 | publication date |
| Proposal available till | 25-05-2025 |
| 4 total number of authors per manuscript | 0 $ |
| The title of the journal is available only for the authors who have already paid for |
| Journal’s subject area: |
| Engineering (all); Condensed Matter Physics; |
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| Free | Free | Free | Free |
| 2350 $ | 1200 $ | 1050 $ | 900 $ |
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Abstract:
When a thermocouple is embedded in a material of lower thermal conductivity, under certain heating or cooling conditions, the presence of the thermocouple can distort the surrounding temperature field. As a result, the measured temperatures may be very different to the ‘undisturbed’ temperatures that would exist without the thermocouple. This study presents the results of a sensitivity analysis of key factors influencing this thermal disturbance. A series of heat transfer models and accompanying experiments are used to demonstrate the effects of thermocouple geometry, contact conditions, thermal properties, and heating regime on the temperature measurement error. These tailored finite element models were validated against experiments on vermiculite insulation board, which confirmed the accuracy of the models in simulating the thermal disturbance for inert heating conditions. Also, a simplified version of the finite element model was used to calculate the thermal disturbance error for a number of conditions, and subsequently to predict a range of corrected temperatures for the experimental measurements. This correction method was found to greatly improve the accuracy of the results for inert heating conditions. Since the method does not account for the effects of moisture in heat transfer, a creep of uncorrected errors could be observed.
Keywords:
Error correction; Fire; Heat transfer; Temperature measurement; Thermocouple; Thermocouple error
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2 place - free (for sale)
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4 place - free (for sale)
Abstract:
When a thermocouple is embedded in a material of lower thermal conductivity, under certain heating or cooling conditions, the presence of the thermocouple can distort the surrounding temperature field. As a result, the measured temperatures may be very different to the ‘undisturbed’ temperatures that would exist without the thermocouple. This study presents the results of a sensitivity analysis of key factors influencing this thermal disturbance. A series of heat transfer models and accompanying experiments are used to demonstrate the effects of thermocouple geometry, contact conditions, thermal properties, and heating regime on the temperature measurement error. These tailored finite element models were validated against experiments on vermiculite insulation board, which confirmed the accuracy of the models in simulating the thermal disturbance for inert heating conditions. Also, a simplified version of the finite element model was used to calculate the thermal disturbance error for a number of conditions, and subsequently to predict a range of corrected temperatures for the experimental measurements. This correction method was found to greatly improve the accuracy of the results for inert heating conditions. Since the method does not account for the effects of moisture in heat transfer, a creep of uncorrected errors could be observed.
Keywords:
Error correction; Fire; Heat transfer; Temperature measurement; Thermocouple; Thermocouple error
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